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Sizzix Die Brush and Foam Pad for Wafer-Thin Dies

£7.00
4 Stars(11)
£7.00
Available for home delivery (free UK delivery over £30)
Click and Collect (order by 4pm Mon-Fri, collect after 2 working days)
International delivery available
FREE returns
0330 026 1400 - Telephone ordering now available

Product description

It’s never been easier to brush away your paper pieces than with the Sizzix Die Brush and Foam Pad for Wafer-Thin Dies! Create unique, intricate papercraft designs and then use this set to effortlessly remove the excess paper from your dies. This product will do the trick with all brands of wafer-thin, chemically-etched dies to leave you with a perfect, defined cut.

The die brush is designed with a sleek, ergonomic rubber-grip handle to prevent slippage and allow for easy manoeuvrability. Also included is a foam mat that provides the ideal surface on which to remove the excess paper from the dies and the cutout.

  • Brush size: 14 x 4.4 cm (5 ½ x 1 ¾ inches)
  • Foam pad size: 4 ½ inches x 7 ¼ inches
  • Includes 1 die brush, 1 foam pad
  • Cleans Framelits, Thinlits and Triplits Dies

Sizzix Die Brush and Foam Pad for Wafer-Thin Dies

Product code: 617844

Reviews (11)

4 Stars4 / 5

Delivery and returns

FREE standard UK delivery
In five to seven working days on orders of £30 and over.
FREE
Click and Collect
Order by 4pm Monday to Friday and collect in store after two working days
£1
Standard UK delivery
In five to seven working days on orders under £30.
£3.50
Next Day UK delivery
Order by 3pm for delivery the next working day
£5.95
FREE UK returns
We don't believe that you should have to pay for return postage.
International delivery
Now available More details >