It’s never been easier to brush away your paper pieces than with the Sizzix Die Brush and Foam Pad for Wafer-Thin Dies! Create unique, intricate papercraft designs and then use this set to effortlessly remove the excess paper from your dies. This product will do the trick with all brands of wafer-thin, chemically-etched dies to leave you with a perfect, defined cut.
The die brush is designed with a sleek, ergonomic rubber-grip handle to prevent slippage and allow for easy manoeuvrability. Also included is a foam mat that provides the ideal surface on which to remove the excess paper from the dies and the cutout.
- Brush size: 14 x 4.4 cm (5 ½ x 1 ¾ inches)
- Foam pad size: 4 ½ inches x 7 ¼ inches
- Includes 1 die brush, 1 foam pad
- Cleans Framelits, Thinlits and Triplits Dies
Sizzix Die Brush and Foam Pad for Wafer-Thin Dies